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ACM Research (Shanghai), Inc. (“ACM Shanghai”) (STAR Market: 688082), a leading provider of wafer-processing solutions for front-end semiconductor manufacturing and advanced wafer-level packaging, announced today the delivery of its first Ultra Lith BK (Baker) advanced photoresist curing system to a top global display manufacturer.
The system is designed to address key challenges in advanced lithography processes—including non-uniformity, temperature drift, and critical dimension (CD) variation—enabling manufacturers to maintain stable yield and pattern fidelity as device geometries continue to shrink. With industry-leading UV curing uniformity and precise thermal management, the Ultra Lith BK ensures highly stable and repeatable lithography performance.
Wang Jian, General Manager of ACM Shanghai, stated:
“As lithography continues to push toward the limits of precision, maintaining uniform process control is vital for achieving stable yield and device performance. The delivery of Ultra Lith BK marks an important milestone for ACM Shanghai—it is the first Track-series system deployed at a customer site following our initial demonstration and validation stages. This also signifies our entry into a new customer segment of high-volume display manufacturers that demand even higher levels of equipment performance and stability. Combining high uniformity, a configurable architecture, and flexible exposure modes, Ultra Lith BK helps customers significantly suppress process variation and lays the foundation for future node mass production.”
The Ultra Lith BK’s UV curing module achieves ±5% intensity uniformity across the wafer, ensuring consistent photoresist hardening. The system supports line-scan, rotational, and hybrid exposure modes, providing maximum process flexibility. Its advanced thermal management further reduces CD variation, overlay error, and pattern distortion, significantly improving yield and reliability.
Key Features and Advantages of Ultra Lith BK:
Integrated with six cooling plates, achieving temperature uniformity of ±0.1°C.
A fully configurable architecture supporting up to 32 hotplates and two UV curing systems, enabling customers to tailor configurations for different process recipes and photoresist integration needs.
Two hotplate options:
High-flow hotplate: maximum process temperature of 250°C, with temperature uniformity ≤0.2%.
Low-flow hotplate: maximum temperature of 180°C, with industry-leading temperature uniformity ≤0.08%.
