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2025 Semiconductor Industry Innovation & International PCB (Greater Bay Area) Expo Successfully Concludes
Date: October 28–30, 2025
Location: Shenzhen International Convention & Exhibition Center (Bao’an)
The 2025 Semiconductor Industry Innovation & International PCB (Greater Bay Area) Expo, also known as CPCA Show Plus 2025, concluded successfully in Shenzhen. Against the backdrop of the global AI wave and key industry transformation, this year’s event marked a milestone for China’s electronics and semiconductor sector.
Covering 40,000 m², the exhibition attracted over 350 leading exhibitors, 100+ industry experts, and more than 45,000 professional visitors over three days. The event showcased the full spectrum of the electronics industry, from PCB design, manufacturing, and equipment, to materials and applications, highlighting China’s capability in AI-era electronics production.
Key highlights include:
Comprehensive industry coverage: From PCB manufacturing and semiconductor packaging to smart devices and green materials, the expo presented a one-stop procurement ecosystem for automotive, industrial, consumer electronics, automation, medical, and AI hardware applications.
Special zones and forums: The expo featured curated zones such as Top 100 Chip Companies, Ceramic Substrate Display, Smart Innovation Area, Automotive Electronics, and Defense Technology Collaboration, offering attendees a clear view of market trends and technological advances.
Knowledge-sharing & collaboration: Over 20 forums and workshops, including international collaborations with Japan, showcased cutting-edge PCB and semiconductor technologies. Key industry leaders from ZTE, Pengding Holdings, Huawei, China Semiconductor Industry Association, and government officials attended the opening ceremony and panel discussions.
Technological breakthroughs: Companies like JLCPCB unveiled 34–64 layer ultra-high multilayer PCBs and HDI high-density interconnect boards, demonstrating advances in precision, performance, and reduced lead times, applicable to aerospace, servers, 5G, ADAS, and other high-performance scenarios.
The event attracted global attention, including major downstream users such as Huawei, Xiaomi, Dyson, HiSilicon, ZTE, Lenovo, BYD, Foxconn, Bosch, Amazon, and Omron, emphasizing China’s PCB manufacturing innovation, industrial chain capabilities, and commitment to AI-era development.
With the theme of “Leap, Innovate, Diversify”, CPCA Show Plus 2025 highlighted China’s electronics industry transformation, innovation, and global vision. The expo demonstrated the sector’s systemic innovation capacity and its ability to support rapid AI-driven industrial growth.
Looking forward: The next CPCA Show Plus is scheduled for October 28–30, 2026 in Shenzhen.
